硅酸盐学报

固结磨料研磨镁铝尖晶石的平均切深和亚表面损伤行为

单位：1. 南京航空航天大学机电学院南京 210016 2. 河南科技学院机电学院河南新乡 454003

关键词：镁铝尖晶石亚表面损伤研磨固结磨料

分类号：O614.8

出版年,卷(期):页码：2017,45(3):402-409

DOI：

摘要：

根据接触力学原理建立了固结磨料研磨的平均切深模型，估算了不同粒径磨料作用下平均切深。依据磨粒平均切深值，采用离散元法对镁铝尖晶石固结磨料研抛的过程进行了模拟，并以此预测了固结磨料研磨条件下工件的亚表面损伤深度。采用角度抛光方法对亚表面损伤层深度的预测值进行了验证。结果表明：W5FAP研磨下工件亚表面损伤层深度的预测值为1.32 μm、实测值为1.37 μm；W14FAP研磨下的预测值为3.93 m，实测值为4.56 μm；W50FAP研磨下的预测值为9.07 μm，实测值为9.12 μm；离散法的亚表面损伤层的预测结果与实测结果基本一致，验证了该方法的可靠性。

A model of average cutting depth in lapping with a fixed abrasive (FA) pad was proposed based on the particle contact mechanics, and the average cutting depths lapped with different size abrasive FA pads were estimated. Furthermore, the lapping process with FA pad for spinel was simulated by discrete element method (DEM) based on the average cutting depth, predicting the subsurface damage of wafer induced by lapping. The prediction was verified via the measurement of the subsurface damage (SSD) lapped with FA pad by an angle polishing method. The results indicate that the predicted depth of subsurface damage with W5 particles is 1.32 μm and the measured value is 1.37 μm; the predicted depth of subsurface damage with W14 particles is 3.93 μm and the measured value is 4.56 μm; the predicted depth of subsurface damage with W50 particles is 9.07 μm and the measured value is 9.12 μm. The predicted data agree well with the measured values. The prediction can offer a theoretical approach for controlling the subsurface damage and optimizing the process parameters in FA lapping.

基金项目：

航空科学基金(2014ZE52055)；国家自然科学基金(51675276)，河南省高等学校重点科研项目(15A460004)；江苏省研究生培养创新工程(KYLX_0229)；中央高校基本科研业务费专项资金；江苏省精密与微细制造技术重点实验室开放基金资助。

作者简介：

王占奎(1980—)，男，博士研究生。

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