硅酸盐学报

超低温烧结微波介质陶瓷研究进展

作者：张高群汪宏

关键词：微波介质陶瓷超低温烧结介电性能综述

分类号：TQ174

出版年,卷(期):页码：2017,45(9):0-0

DOI：

摘要：

超低温烧结微波介质陶瓷作为无源集成技术的主要介质材料，可广泛应用于无线通讯、可穿戴电子、物联网和全球定位系统等领域，其相关研究具有重要的应用价值和理论指导意义，是目前功能材料领域的研究热点之一。本文综合介绍了超低温烧结微波介质陶瓷材料的应用背景和主要的材料体系，以及主要材料体系的介电性能和优缺点，探讨了材料组分、介电常数、Qf值、频率温度系数之间的关系，阐述了超低温烧结陶瓷材料的性能调控手段，并指出了今后超低温烧结微波介质陶瓷材料的主要发展前景和研究方向。钼酸盐基超低温烧结陶瓷兼具超低烧结温度、系列化介电常数和低损耗等优点，有望实现在超低温共烧技术中的应用。离子取代和多相复合是有效调控材料微波介电性能的方法，使材料更利于应用。

基金项目：

国家重点研发计划(2017YFB0406303)资助。

作者简介：

张高群(1987—)，女，博士。

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