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非晶相界面SiC/Cu复合材料的制备
作者: 冰1  硕1  斌1 郗雨林1  锐2 
单位:(1. 中国船舶重工集团公司第七二五研究所 河南 洛阳 471023 2. 郑州航空工业管理学院 郑州 450046) 
关键词:碳化硅/铜复合材料 非晶相 润湿性 界面结合 
分类号:TB333
出版年,卷(期):页码:2019,47(1):0-0
DOI:10.14062/j.issn.0454-5648.2019.01.14
摘要:

 采用真空热压法制备了体积分数为20%的界面非晶相SiO2–B2O3–Na2O的SiC/Cu[V(SiC):V(Cu)=35:65]复合材料。烧结温度为650、700、750、800 ℃,保温时间为0.5 h。利用X射线衍射和扫描电子显微镜对烧结样品的组成及形貌进行了表征。采用了Archimedes原理及显微硬度仪测量了烧结样品的气孔率和硬度。结果表明:添加非晶相的SiC/Cu复合材料的致密化烧结温度降低了200 ℃,样品的气孔率降低至0.2%;硬度提高了64%,达到了2.3 GPa。研究发现,非晶相修饰界面并起到了“粘结剂”的作用,提高了SiC/Cu界面润湿性,改善了微观结构的均匀性。

 SiC/Cu composites [V(SiC):V(Cu)=35:65] with a 20% interface SiO2–B2O3–Na2O amorphous phase were prepared by vacuum hot pressing. The hot-press temperatures were 650, 700, 750 and 800 °C for 0.5 h. Sintered samples were characterized by X-ray diffraction and scanning electron microscopy. The porosity and hardness were measured by Archimedes principle and a microhardness tester. The results show that the densification sintering temperature of SiC/Cu composites with an amorphous phase decreases by 200 °C, and the porosity decreases to 0.2%. The hardness is increased by 64% to 2.3 GPa. It is also observed that the amorphous phase modified composites possess homogeneous microstructure due to the presence of amorphous film between Cu and SiC, which acts as a “binder” to improve the wettability of Cu and SiC. Meanwhile, the possible mechanism for the wettability improvement has been proposed.

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参考文献:

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